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Name： The main performance requirements of target |
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Detail |
Purity
Purity is the main performance indicator targets, because the target performance of the purity of a great influence on the film. However, in practice, the purity of the target are not the same. For example, with the rapid development of microelectronics industry, wafer sizes from 6 ", 8"development to 12 "and the wiring width decreases from the 0.5um to 0.25um, 0.18um or 0.13um, before the purity of 99.995% of the target 0.35umIC process requirements to meet, and the purity of preparation 0.18um lines on the target or even require 99.9999% 99.999%.
Impurities
Target of solid impurities and porosity in the oxygen and water vapor are the major source of pollution deposited film. Targets for different purposes in different impurity content requirements are also different. For example, the semiconductor industry with the aluminum and aluminum alloy target, radioactive elements on the content of alkali metal content and have special requirements.
Density
In order to reduce the porosity of solid targets to improve the performance of sputtered films, usually require a higher target density. Density not only affects the target sputtering rate, also affects the electrical and optical properties of thin films. Target density, the higher the better the performance of the film. In addition, the increased density and intensity of target to target to better withstand the thermal stress in the sputtering process. Density is a key performance indicator targets.
Grain size and grain size distribution
Usually polycrystalline target structure and the size can be microns to millimeters. For the same target, sputtering target with fine grains of coarse grains than the target rate of sputtering rate fast; the difference between the smaller grain size (distribution) of the target sputtering deposition more uniform film thickness distribution . |
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